Poʻai pepa alumini

ʻO ka wehewehe pōkole:

ALLOY 1100 1050 3003 8011 mānoanoa 0.5mm 1mm 2mm 3mm 4mm (Range 0.5 a 4mm) ʻO ke anawaena ʻaoʻao 300mm 600mm 900mm (ka laulā 300mm -1000mm).

Kaʻina hana: Hana ʻia ka wafer me ka hoʻolei alumini a me nā mea ʻōwili, a laila hoʻopaʻa ʻia a hana ʻia.Hiki ke hana ʻia ke ʻano kūikawā e ka ʻoki ʻana i ka laser.


Huahana Huahana

Huahana Huahana

Hoʻohana nui ʻia no nā hōʻailona kalepa, nā huahana papa ʻaina alumini, a me nā huahana wafer ʻoihana ʻē aʻe.

Ka manawa hoʻopuka hana: E like me ka hoʻolālā kauoha, hiki ke hāʻawi ʻia ma kahi o 1 pule.

ʻO kā mākou pōʻai pepa alumini Ua lawe ʻia aku i nā ʻāina he 15, me nā ʻāina ʻEulopa, a loaʻa iā ia kahi palapala hōʻoia ʻoihana, e ʻoluʻolu e kūʻai.

MAKEMAKE IKE

PIKI MAMUA O KA HOOKAPU

Hōʻikeʻike huila

ALLOY 1100 1050 3003 8011 mānoanoa 0.5mm 1mm 2mm 3mm 4mm (Range 0.5 a 4mm) ʻO ke anawaena ʻaoʻao 300mm 600mm 900mm (ka laulā 300mm -1000mm).

Kaʻina hana: Hana ʻia ka wafer me ka hoʻolei alumini a me nā mea ʻōwili, a laila hoʻopaʻa ʻia a hana ʻia.Hiki ke hana ʻia ke ʻano kūikawā e ka ʻoki ʻana i ka laser.

Hoʻohana nui ʻia no nā hōʻailona kalepa, nā huahana papa ʻaina alumini, a me nā huahana wafer ʻoihana ʻē aʻe.

Ka manawa hoʻopuka hana: E like me ka hoʻolālā kauoha, hiki ke hāʻawi ʻia ma kahi o 1 pule.

ʻO kā mākou pōʻai pepa alumini Ua lawe ʻia aku i nā ʻāina he 15, me nā ʻāina ʻEulopa, a loaʻa iā ia kahi palapala hōʻoia ʻoihana, e ʻoluʻolu e kūʻai.

Nā hiʻohiʻona ʻenehana o ka laina hana

1. CNC 'akomi, ka laina hana mai ka unwinding o ka wili, a hiki i ka leo holoʻokoʻa o nā mea lako blanking waena i ole pono manual contact me kekahi nui, aole pono i kekahi hoʻololi, fundamentally hoʻopau i ka paʻi maʻamau blanking hana palekana. a me ka maikaʻi o ka huahana huna pilikia.

2. Hiki i ka laina ke hoʻohana pono i nā mea coil no ka hana ʻana i ka wafer, ʻaʻole pono e ʻōwili i nā mea slitting a me ka crosscutting treatment, hoʻemi i ke kaʻina hana, hoʻemi i ke kumukūʻai hana, hoʻemi i ka hiki ke hōʻino i ka ʻili o ka coil material, ka hana ʻana o ka wafer e hōʻoia ʻole ʻaila, ʻaʻohe ʻōpala.

3. Hoʻohana piha kēia laina i ka laulā o ka coil, me ka hoʻohana ʻana i ka mana ʻōnaehana servo motor drive kiʻekiʻe, i hiki ai i ka wafer spacing a me ka mamao mai ka wafer a hiki i ka ʻaoʻao mea e hoʻemi i ka liʻiliʻi, e hoʻemi nui i ka nui o ʻōpala, no laila ka nui o ka hoʻohana ʻana i nā mea maka a hiki i 80%.

4. Hiki i ka wikiwiki hana ke hiki i nā'āpana 40-55 i kēlā me kēia minuke, e hoʻomaikaʻi i ka pono hana.

5. Ma muli o ka hoʻolālā modular mold, i ka hoʻololi ʻana i nā kikoʻī hana wafer, hiki ke hoʻemi ʻia ka manawa hoʻololi i lalo o 15 mau minuke.Hiki ke hana ʻia nā diski ma nā ʻano anawaena mai 85 mm a 750 mm.

ʻO ka ʻōnaehana uncoiling kiʻekiʻe, ʻeono-fold leveling machine, high-rigidity mechanical press, automatic palletizing system, etc., e hōʻoia i ka kiʻekiʻe o nā huahana wafer.


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